![]() ![]() ![]() More info on: ESEC 2100 FC PLUS Esec as a renowned leader in providing die bonders for trouble free high quality mass production has integrated flip chip capability into its 2100 family of die bonders: Esec’s response to driving down the cost of flip chip technology. Equipped with integrated dispenser, 12” wafer handling, automatic tool changer, and application specific tooling, the 2200 evo is prepared for present and future processes and products. DATACON 2200 evo The 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications. DATACON 2200 EVO DATACON 2200 EVO MANUAL MANUEL FOR BESI DATACON EVO. Dyno and Drag Strip measure horsepower (manual transmission only) and acceleration. Discover all the information about the product Flip-chip die bonder Datacon 2200 evo - BE Semiconductor Industries and find where you can buy it. ![]()
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March 2023
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